The two universities will work together to offer a 2+2 program for a bachelor’s degree in engineering with a semiconductor technology concentration.
A Letter of Intent (LOI) to create academic cooperation and provide cooperative educational programs and research initiatives has been signed between Rensselaer Polytechnic Institute (RPI) and Birla Institute of Technology and Science (BITS) Pilani. The programs are a step toward enhancing two universities’ international academic cooperation in the domains of science, technology, and engineering.
The two colleges will endeavor to offer a 3+2 program for a bachelor’s and master’s degree in engineering, as well as a 2+2 program for a bachelor’s degree in engineering with an emphasis on semiconductor technologies, according to the official press release. Through the programs, students will be able to attend both schools and graduate with degrees from RPI and BITS Pilani.
This collaboration intends to equip professionals for the sector and is in line with the goals of the US CHIPS program and the India Semiconductor Mission. Additionally, both institutes will create a center of excellence in battery technology and carry out cooperative research through a combined PhD program.
According to the institute, senior leadership from BITS Pilani, including V Ramgopal Rao, Group Vice Chancellor, Arya Kumar, Senior Professor and Dean of Alumni Relations, and Sachin Arya, Head of Alumni Relations and Technology Business Incubators, BITS Pilani, visited RPI to formalize the agreement.
Speaking on the occasion, vice chancellor of BITS Pilani, V Ramgopal Rao, said, “Our collaboration with Rensselaer Polytechnic Institute is a significant milestone in providing global education and research programs for Indian students. RPI is a leading university embedded firmly in the Semiconductor Ecosystem, especially Albany Nano, a public R&D ecosystem involving academia, industry and the government in Albany, New York. The partnership provides an exciting opportunity for students and researchers to shape and lead innovations for the future.”
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